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| BSC027N03S G OptiMOS(R)2 Power-Transistor Features * Fast switching MOSFET for SMPS * Optimized technology for notebook DC/DC converters * Qualified according to JEDEC for target applications * Logic level / N-channel * Excellent gate charge x R DS(on) product (FOM) * Very low on-resistance R DS(on) * Superior thermal resistance * Avalanche rated * dv /dt rated * Pb-free lead plating; RoHS compliant Type BSC027N03S Package PG-TDSON-8 Marking 27N03S 1 Product Summary V DS R DS(on),max ID 30 2.7 100 V m A PG-TDSON-8 Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current Symbol Conditions ID T C=25 C T C=100 C T A=25 C, R thJA=45 K/W 2) Pulsed drain current Avalanche energy, single pulse Reverse diode dv /dt Gate source voltage Power dissipation I D,pulse E AS dv /dt V GS P tot T C=25 C T A=25 C, R thJA=45 K/W 2) Operating and storage temperature IEC climatic category; DIN IEC 68-1 Rev. 0.93 page 1 T j, T stg T C=25 C3) I D=50 A, R GS=25 I D=50 A, V DS=24 V, di /dt =200 A/s, T j,max=150 C Value 100 90 25 200 800 6 20 89 2.8 -55 ... 150 55/150/56 2006-05-09 C mJ kV/s V W Unit A BSC027N03S G Parameter Symbol Conditions min. Thermal characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient R thJC R thJA minimal footprint 6 cm2 cooling area2) 1.4 62 45 K/W Values typ. max. Unit Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D=1 mA V GS(th) I DSS V DS=V GS, I D=90 A V DS=30 V, V GS=0 V, T j=25 C V DS=30 V, V GS=0 V, T j=125 C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=20 V, V DS=0 V V GS=4.5 V, I D=50 A V GS=10 V, I D=50 A Gate resistance Transconductance RG g fs |V DS|>2|I D|R DS(on)max, I D=50 A 30 1.2 1.6 0.1 2 1 A V 63 10 10 3.1 2.3 1.2 127 100 100 3.9 2.7 S nA m 1) 2) J-STD20 and JESD22 2 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. 3) See figure 3 Rev. 0.93 page 2 2006-05-09 BSC027N03S G Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics 4) Gate to source charge Gate charge at threshold Gate to drain charge Switching charge Gate charge total Gate plateau voltage Gate charge total, sync. FET Output charge Reverse Diode Diode continous forward current Diode pulse current Diode forward voltage IS I S,pulse V SD T C=25 C V GS=0 V, I F=50 A, T j=25 C V R=15 V, I F=I S, di F/dt =400 A/s 0.83 50 200 1 V A Q gs Q g(th) Q gd Q sw Qg V plateau Q g(sync) Q oss V DS=0.1 V, V GS=0 to 5 V V DD=15 V, V GS=0 V V DD=15 V, I D=25 A, V GS=0 to 5 V 14 7.9 10 16 38 2.8 33 39 19 10 14 22 51 44 52 V nC nC C iss C oss Crss t d(on) tr t d(off) tf V DD=15 V, V GS=10 V, I D=25 A, R G=2.7 V GS=0 V, V DS=15 V, f =1 MHz 4920 1750 220 8.8 8 39 6 6540 2330 330 13 12 58 10 ns pF Values typ. max. Unit Reverse recovery charge Q rr - - 18 nC 4) See figure 16 for gate charge parameter definition Rev. 0.93 page 3 2006-05-09 BSC027N03S G 1 Power dissipation P tot=f(T C) 2 Drain current I D=f(T C); V GS10 V 100 120 80 100 80 60 P tot [W] I D [A] 40 20 0 0 40 80 120 160 60 40 20 0 0 40 80 120 160 T C [C] T C [C] 3 Safe operating area I D=f(V DS); T C=25 C; D =0 parameter: t p 103 limited by on-state resistance 4 Max. transient thermal impedance Z thJC=f(t p) parameter: D =t p/T 101 10 s 102 100 s 100 0.5 Z thJC [K/W] I D [A] 0.2 0.1 1 ms 101 10 ms 10-1 0.05 0.02 DC 0.01 single pulse 100 10 -1 10-2 10 0 10 1 10 2 10-5 10-4 10-3 10-2 10-1 100 V DS [V] t p [s] Rev. 0.93 page 4 2006-05-09 BSC027N03S G 5 Typ. output characteristics I D=f(V DS); T j=25 C parameter: V GS 200 10 V 4V 6 Typ. drain-source on resistance R DS(on)=f(I D); T j=25 C parameter: V GS 10 3V 3.2 V 3.4 V 160 4.5 V 3.7 V 8 R DS(on) [m] 120 6 I D [A] 3.4 V 3.7 V 80 3.2 V 4 4V 4.5 V 40 3V 2.8 V 2 10 V 0 0 1 2 3 0 0 50 100 V DS [V] I D [A] 7 Typ. transfer characteristics I D=f(V GS); |V DS|>2|I D|R DS(on)max parameter: T j 200 8 Typ. forward transconductance g fs=f(I D); T j=25 C 160 160 120 120 g fs [S] 80 40 150 C 25 C I D [A] 80 40 0 0 1 2 3 4 5 0 0 25 50 75 V GS [V] I D [A] Rev. 0.93 page 5 2006-05-09 BSC027N03S G 9 Drain-source on-state resistance R DS(on)=f(T j); I D=50 A; V GS=10 V 10 Typ. gate threshold voltage V GS(th)=f(T j); V GS=V DS parameter: I D 5 2.4 4 2 900 A 1.6 R DS(on) [m] 3 98 % V GS(th) [V] 90 A typ 1.2 2 0.8 1 0.4 0 -60 -10 40 90 140 190 0 -60 -10 40 90 140 190 T j [C] T j [C] 11 Typ. capacitances C =f(V DS); V GS=0 V; f =1 MHz 12 Forward characteristics of reverse diode I F=f(V SD) parameter: T j 104 10000 103 Ciss 150 C 25 C 150 C, 98% Coss 10 2 C [pF] I F [A] 103 25 C, 98% 1000 101 Crss 102 100 100 10 20 30 0 0.5 1 1.5 2 0 V DS [V] V SD [V] Rev. 0.93 page 6 2006-05-09 BSC027N03S G 13 Avalanche characteristics I AS=f(t AV); R GS=25 parameter: T j(start) 100 14 Typ. gate charge V GS=f(Q gate); I D=25 A pulsed parameter: V DD 12 15 V 25 C 100 C 24 V 125 C 10 6V 8 10 V GS [V] 1 10 100 1000 I AV [A] 6 4 2 1 0 0 25 50 75 t AV [s] Q gate [nC] 15 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=1 mA 16 Gate charge waveforms 38 V GS 35 Qg 32 V BR(DSS) [V] 29 V g s(th) 26 23 Q g(th) Q gs -60 -10 40 90 140 190 Q sw Q gd Q g ate 20 T j [C] Rev. 0.93 page 7 2006-05-09 BSC027N03S G Package Outline P-TDSON-8: Outline PG-TDSON-8 Footprint Dimensions in mm Rev. 0.93 page 8 2006-05-09 BSC027N03S G Package Outline P-TDSON-8: Tape Dimensions in mm Rev. 0.93 page 9 2006-05-09 BSC027N03S G Published by Infineon Technologies AG 81726 Munchen, Germany (c) Infineon Technologies AG 2006. All Rights Reserved. Attention please! The information given in this data sheet shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 0.93 page 10 2006-05-09 |
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